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ISL29020
D LENS
D 2 > 1.5mm
LIGHT PIPE
t
L
ISL29020
FIGURE 5. WINDOW WITH LIGHT GUIDE/PIPE
D 2
D LENS
Suggested PCB Footprint
It is important that the users check the “Surface Mount
Assembly Guidelines for Optical Dual FlatPack No Lead
(ODFN) Package” before starting ODFN product board
mounting.
Layout Considerations
The ISL29020 is relatively insensitive to layout. Like other
I 2 C devices, it is intended to provide excellent performance
even in significantly noisy environments. There are only a
few considerations that will ensure best performance.
Typical Circuit
A typical application for the ISL29020 is shown in Figure 6.
The ISL29020’s I 2 C address is hardwired as 1000100. The
device can be tied onto a system’s I 2 C bus together with
other I 2 C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The plastic
ODFN package does not require a custom reflow soldering
profile, and is qualified to +260°C. A standard reflow soldering
profile with a +260°C maximum is recommended.
Route the supply and I 2 C traces as far as possible from all
sources of noise. Use one 0.01μF power-supply decoupling
capacitor, placed close to the device.
1.7V TO 3.6V
R1
10k Ω
R2
10k Ω
I 2 C MASTER
MICROCONTROLLER
SDA
SCL
2.25V TO 3.3V
I 2 C SLAVE_0
I 2 C SLAVE_1
I 2 C SLAVE_n
1
2
VDD
GND
SDA
SCL
6
5
SDA
SCL
SDA
SCL
C1
0.01μF
3
REXT
A 0
4
REXT
500k
ISL29020
FIGURE 6. ISL29020 TYPICAL CIRCUIT
8
FN6505.1
August 20, 2009
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